Antenna in Parcel Patent Panorama Market Report 2021 – that includes AAC Applied sciences, Boeing and Broadcom, amongst others – ResearchAndMarkets.com

DUBLIN – (BUSINESS WIRE) – The report “Antenna in the Package Patent Landscape 2021” has been added ResearchAndMarkets.com to offer.

The publisher has been tracking intellectual property (IP) trends in relation to RF front-end devices and their packaging since 2017. Recently, the publisher observed increasing patenting activity in relation to PAMiD modules, RF front-end modules, RF filters and switch integration, as well as antennas for 5G and their packaging.

The packaging of 5G systems requires the integration of RF, analog and digital functions along with passive components and other system components in a single module. These systems are examples of the heterogeneous integration trend that is becoming increasingly important for 5G. The proximity of the transceiver and the front-end module is also important to reduce size and loss. This is achieved by integrating antennas into the RF module as well as modeling a heat dissipation solution at the same time to keep active components in acceptable thermal conditions.

In the mm-wave antenna-in-package solutions, connections between transceiver ICs and antennas should result in low insertion loss and acceptable return loss over the frequency range of interest. The other key requirement is form factor, and to meet it, the industry is gradually moving from traditional interconnection techniques such as wire bonding and flip-chip interconnection to new techniques known as fan-out packaging, or IC embedding.

Flip-chip and fan-out connections were originally designed for high performance computers or mobile processor applications, but their fine pitch and low electrical parasites have led RF players to use them in their RF / mm-wave modules. Today these approaches are becoming more and more critical for the RF industry and are used in antenna-integrated modules.

In this report, the publisher analyzes the patent landscape around the antenna integrated in the package (AiP, AoP). The AiP patent landscape is spearheaded by major semiconductor foundries and OSATs, with SJ Semiconductor (SJSemi) being the primary assignee and covering all links in the supply chain. Foundries / OSATs (SJSemi / SMIC, TSMC, SEMCO, ASE, SPIL) as well as IDMs / Fabless (MediaTek, Qualcomm, Murata, TI, Skyworks) and OEMs (Huawei, Vivo mobile, Oppo mobile) have applied for AiP-related patents for their Protect structures / designs or manufacturing processes.

Understand the activities of the current IP players

The editor has identified more than 140 different companies that have filed patent applications related to AiP. The report provides a clear overview of the most active assignees as well as a presentation of the IP newbies. In addition, a patent segmentation shows the technical position, e.g. WLP, fan-out, flip chip or antenna type, of the individual main players.

SJSemi, Intel, and TSMC have the most significant enforceable portfolio; together they own a third of all granted patents. In recent years, SJSemi, TSMC, Samsung, MediaTek, Huawei, AAC Technologies and NCAP have stepped up their patenting activities.

The IP newcomers of the past 2 years are mainly Chinese companies that focus on a wafer-level packaging approach for integrated antennas: Vivo Mobile, OPPO Mobile, Shanghai Xianfang Semiconductor (subsidiary of NCAP), Powertech Technology, Microsilicon Technology, T-Ray Technology, Sky Semiconductor Technology, Xinhua Microelectronics and Unisoc.

The IP whitespaces are shrinking

The patents describe a variety of solutions for designing or manufacturing antenna systems in packages, and not many patents focus on critical technological building blocks. The AiP patent landscape is evidence of well-mastered packaging solutions that are already available on the market and in which the IP “whitespaces” are quickly limited. Each player has developed and protected their own AiP structures / designs, each offering a solution to meet the different needs of next generation handset RF packets. The patents mainly claim specific AiP structures / designs or processes / methods for their manufacture. Enforcing your own patents against infringing products is easier with patents claiming an AiP structure / design, and patent disputes on such aspects will therefore be inevitable in a growing 5G market.

Companies mentioned in this report (non-exhaustive list):

  • A STAR

  • AAC technologies

  • ASE

  • AT&S

  • Boeing

  • Bosch

  • Broadcom

  • CETC

  • Chengdu Ruishi Intelligent Technology

  • Chengdu T Ray technology

  • Chunghwa precision testing technology

  • Vein

  • Dongwoo Fine Chemicals

  • Dupont electronics

  • Ericsson

  • Forehope Electronic Ningbo

  • Fraunhofer

  • Fujikura

  • GlobalFoundries

  • Guangdong Fozhixin microelectronics technology research

  • Guangdong Xinhua microelectronic technology

  • Hanyang University

  • Huawei

  • IBM

  • Imec

  • Innolux

  • Institute of Microelectronics – Chinese Academy of Sciences

  • Intel

  • JCAP

  • JCET

  • Kyocera

  • LG electronics

  • LS Mtron

  • Mediatek

  • Micron technology

  • Microsilicon technology

  • Murata

  • NCAP

  • Nanjing Qinheng microelectronics

  • National Chung Shan Institute of Science and Technology

  • To breathe

  • New Kojinpeng Private

  • Novaco microelectronic technologies

  • Oppo Mobile

  • Powertech technology

  • Qingdao Geer Smart Sensor

  • Qualcomm

  • Raytheon

  • SJ Semiconductor

  • minimum wage

  • GAME

  • STATS ChipPAC

  • Saint-Gobain

  • Samsung electromechanics

  • Samsung electronics

  • Shanghai Amphenol Airwave communication electronics

  • Shanghai Xianfang semiconductor

  • Skyworks

  • Sony

  • Spreadtrum communication

  • TDK Epcos

  • TSMC

  • Texas Instruments

  • Tsinghua University

  • Vega Grieshaber

  • Vivo-Mobil

  • Xiamen Yun Tian semiconductor technology

Please visit https://www.researchandmarkets.com/r/nz1jf2 for more information on this report

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