D3 Engineering mmWave radar sensor in automotive high quality integrates antenna array in 1-inch housing

D3 Engineering announced the DesignCore RS-6843AOPUA mmWave radar sensor, an AECQ-100 qualified 60GHz radar that includes a Texas Instruments C674x DSP, Arm Cortex-R4F MCU, radar accelerator and antenna array on the box integrated. The HF front end integrates a PLL, three transmitters, four receivers and a baseband ADC and enables the sensor to cover up to 4 GHz with a transmission power of 12 dBm and noise characteristics of better than 15 dB.

The 1 “x 1” x 1 “sensor is a production-oriented device with a heat-dissipating metal housing and mounting brackets. It can be tested and evaluated via a USB serial interface and used with a PC or embedded development platforms.

The sensor is available in two versions:

  • RS-6843AOPA – Has a header with additional functions and interfaces such as I2C, SPI, GPIO and UART for connection to optional baseboards or hosts.
  • RS-6843AOPUA – Uses a USB-C port as the primary interface providing power, as well as a serial UART for the console and another for processed radar returns or algorithmic output.

The sensors’ custom firmware ensures board support for the latest TI SDK. The DesignCore RS-6843AOPUA is available for pre-order now.

For more information, including specifications and drawings, download the data sheet or visit www.d3engineering.com.

About the author

Brandon Lewis, Editor in Chief of Embedded Computing Design, is responsible for driving content strategy, editorial targeting, and engagement of the engineering community, including IoT design, automotive embedded systems, power page, industrial AI, and machine learning other publications. A seasoned technical journalist, editor and reporter with the ability to identify key technologies, products and market trends in the embedded technology space, he enjoys covering topics ranging from development kits and tools to business models for cybersecurity and technology. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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