Hprobe claims to have the primary turnkey check gear for 3D magnetic sensors

The equipment is based on Hprobe’s 3D magnetic field generator technology for single and multi-point testing at wafer level under magnetic field.

It works with automated wafer test stations and external electrical testers and offers significant throughput rates with high flexibility and compatibility with existing platforms for end users.

“Our new devices deal with the crucial step of chip sorting for the new generation of magnetic sensors that have been tested at the wafer level, with high field strength and over a large area. It offers fully controllable 3D static and variable magnetic field functionality that enables the use of a single platform to test different types of products, “says Siamak Salimy, Founder and CTO of Hprobe.” This is key for our customers and an important milestone for the industry This is evident from orders that have already been received from a number of large sensor manufacturers. “

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