MixComm Declares Breakthrough Antenna Bundled for 5G mmWave Infrastructure

MixComm Announces Breakthrough Antenna Bundled for 5G mmWave Infrastructure

MixComm, the pioneer of mmWave Antennas for Algorithms ™, announced the latest addition to its portfolio of groundbreaking 5G mmWave solutions.

MixComm’s ECLIPSE3741 is a highly integrated 5G Beamformer Phased Array Antenna in Package (AiP) module. It combines several integrated MixComm RFSOI beamforming front end circuits with a 16 element (4×4) antenna array. It covers the FR2 band n260 from 37.0 to 41.0 GHz and offers exceptionally high linear output power, efficiency and extreme integration. This AiP module is designed to provide e / 2 wavelength antenna grid spacing when tiled together to support higher power applications. It has also been extensively optimized for thermal management.

The AiP approach has been desirable since the earliest mmWave developments. However, the excessive heat dissipation of legacy beamforming ICs and the inability to use high-volume packaging technology made previous attempts either too expensive or not meeting the reliability standards required for cellular communications. MixComm, with its energy-efficient architecture and several generations of experience with RFSOI, has solved these challenges with a highly reliable and cost-effective AiP for 5G infrastructure.

By integrating the integrated beamforming front-end circuits together with the antenna array, the ECLIPSE3741 makes it much easier to design and manufacture lower-cost, more compact mmWave 5G systems with higher data rates. With its easy scalability, the ECLIPSE3741 is ideal for any type of 5G infrastructure equipment, from:

  • Consumer Premises Equipment (CPE)
  • Fixed wireless access (FWA)
  • Repeater and Integrated Access Backhaul (IAB)
  • To cellular base stations (gNodeB)

“Innovative semiconductor vendors are making important improvements in the cost, performance, and power consumption of mmWave beamformer ICs and modules,” said Phil Solis, director of research at IDC. “These new solutions will be critical to lowering mobile operator costs by reducing the number of mmWave radio systems per area, lowering overall recurring electricity costs, reducing the size and weight of mmWave radio systems, and increasing the performance and reliability of the mmWave system. Increase 5G service. “

“We are pleased to be working with MixComm to enable and provide market-driven antenna-in-package solutions that are critical to the implementation of 5G millimeter-wave systems,” said Guido Ueberreiter, Vice President of Pre and Post Fab Operations at GLOBALFOUNDRIES. “Operating at these higher frequencies is not only a successful silicon design, but also providing accurate RF modeling of the case and advanced RF test capabilities, including over-the-air (OTA) if required. Co-designing the silicon with the case along with RF testing is key to achieving the best performance and creating product differentiation for our customers. ”

“The challenges facing 5G mmWave require end-to-end solutions that allow optimization beyond the traditional functional boundaries that have characterized RF subsystems,” said Dr. Harish Krishnaswamy, Co-Founder and CTO of MixComm, added, “AiP for 5G mmWave represents the next frontier in this development.”

“The ECLIPSE3741 AiP extends the efficiency, high output and state-of-the-art performance of MixComm’s Summit mmWave transceivers through to the antennas. The ECLIPSE family of products aims for scalability in the critical mmWave antenna IC interface and will translate directly into higher performance and lower cost for mmWave arrays, ”said Dr. Arun Natarajan, MixComm VP of RF Technology.

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