Nordic Semiconductor: The Bluetooth module with progressive antenna know-how makes use of the NordC SoC nRF52811 to offer wi-fi connectivity for wearables and …
Nordic Semiconductor today announced that Tokyo, Japan-based multinational conglomerate Toshiba Corporation has released the Wafer Level Chip Scale Package (WLCSP) (2.48 x 2.46 mm) version of Nordics nRF52811 Bluetooth® Low Energy (Bluetooth LE) -System-on-Chip (SoC)) to provide the core processing power and wireless connectivity for the Bluetooth module with SASP ™ technology. The module with integrated antenna has a miniaturized 4 x 10 x 1 mm form factor, weighs 0.09 g and, according to Toshiba, is the world’s smallest Bluetooth LE module of its kind.
Flexibility for developers
The company’s proprietary SASP (Slot Antenna on Shielded Package) technology was developed to minimize the size of the module by using the shielded packaging to hold part of the antenna. As a result, the area that the remaining antenna length takes up on the module board and the corresponding exclusion zone for components (“exclusion zone”) is reduced compared to competing modules. In addition, unlike competing modules, the restricted zone does not extend beyond the boundaries of the module’s circuit board. This gives designers greater flexibility in placing peripheral components such as connectors and sensors, for example on the back of the final product board, further reducing the size of the final product.
The Bluetooth module with SASP technology is driven by the NordC SoC nRF52811 and contains not only the antenna, but also two crystals and the passive components for operating HF and DC-DC controllers.
Fully automatic energy management
The module enables robust processing and wireless multi-protocol connectivity in applications where both space and cost are limited – especially clothing / wearables such as smartwatches and ear-worn devices for health monitoring and exercise analysis as well as various IoT applications with limited power supply for sending and Receiving data from sensors. The nRF52811 SoC at the heart of the module is designed to minimize power consumption with a fully automated power management system that reduces power consumption by up to 80 percent compared to the nRF51 series.
The multi-protocol SoC nRF52811 from Nordic combines a powerful 64 MHz 32-bit Arm® Cortex® M4 processor with a 2.4 GHz radio device (supports direction finding, Bluetooth 5.2, Thread, ZigBee, IEEE 802.15.4 and proprietary 2.4 GHz RF protocol software) 4 dBm output power with a sensitivity of -97 dBm (at 1 Mbit / s in Bluetooth 5 mode) and 192 KB flash memory plus 24 KB RAM. The nRF52811 is the first low-power product in Nordic’s wireless range that supports direction finding. This precisely positions the functions for high throughput, long range and improved coexistence of Bluetooth 5. The SoC comes with Nordics S112 SoftDevice, a Bluetooth 5 -certified RF software protocol stack for building advanced Bluetooth LE applications. The S112 SoftDevice has peripheral and broadcaster Bluetooth LE roles, supports up to four connections and enables roles to be operated at the same time.
“We selected Nordic’s nRF52811 SoC for our Bluetooth module with SASP technology because the chip is inexpensive, compact, low-power, and offers a generous flash memory allocation,” said Keiju Yamada, SASP project manager at Toshiba. “Nordic has impressive software and demo sample code to aid development.”
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Nordic Semiconductor ASA posted this content on May 10, 2021 and is solely responsible for the information contained therein. Distributed by the public, unedited and unchanged, on May 10, 2021 7:50:03 AM UTC.